Method of treating surface of rotating wafer using surface treat

Details Method of treating surface of rotating wafer using surface treat Method of treating surface of rotating wafer using surface treat

1991-11-06

1993-09-28

Dang, Thi

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156640, 156646, 134 31, 134 33, 427 8, 4272555, B05D 100

Patent

active

052483800

ABSTRACT:
A surface treatment method of treating a main surface of a wafer by a surface treating gas while rotating the wafer at a predetermined rotation speed includes the steps of: determining, before surface treatment of the product wafer, a first rotation speed at which the result of a comparison between the speed of surface treatment in the center of rotation of the main surface of a product wafer and the speed of surface treatment in the periphery of it is inverted; and supplying a surface treating gas to the main surface of the product wafer while rotating the product wafer at the determined first rotation speed. The first rotation speed is selected to be corresponding to the inflection point of a curved line of a function which represents the relation between the surface treatment rate and the rotation speed of the wafer. Surface treatment is carried out at uniform treatment rate over the whole surface of the wafer by rotating the wafer the first rotation speed.

REFERENCES:
patent: 4544446 (1985-10-01), Cady
patent: 4681776 (1987-07-01), Bok
patent: 4980204 (1990-12-01), Fujii et al.
patent: 5032217 (1991-07-01), Tanaka

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