Method of treating semiconductor wafers

Details Method of treating semiconductor wafers Method of treating semiconductor wafers

1974-07-30

1976-04-20

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29580, 156 16, 156 17, 156610, H01L 2120, H01L 21302

Patent

active

039517284

ABSTRACT:
A method of treating wafers, wherein a plurality of wafers are stacked and immersed in an etchant, to work, i.e., etch, the peripheral surfaces of the wafers. Sliced semiconductor wafers or metallic or ceramic wafers can be chemically chamfered in this manner.

REFERENCES:
patent: 3325392 (1967-06-01), Rummel
patent: 3421962 (1969-01-01), Topas
patent: 3438809 (1969-04-01), Kaueggia et al.
patent: 3657004 (1972-04-01), Merkel et al.
patent: 3679517 (1972-07-01), Schulten et al.
patent: 3756876 (1973-09-01), Brown et al.
patent: 3762945 (1973-10-01), DiLorenzo
patent: 3808065 (1974-04-01), Robinson et al.

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