Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Post imaging radiant energy exposure
Patent
1988-01-22
1989-12-19
Dees, Jose G.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Post imaging radiant energy exposure
430326, G03C 516
Patent
active
048882712
ABSTRACT:
Ultraviolet radiation process applies to manufacture semiconductor devices in order to enhance the thermal stability of the developed positive photoresist film on semiconductor wafers.
A method, in ultraviolet radiation process, and an apparatus enabling the high-speed and effective treatment of the positive photoresist empolying ultraviolet irradiation by preventing the deformation of the developed positive photoresist image which is caused by the light radiated from a discharge lamp such as high pressure mercury vapor lamp. These method and apparatus employ ultraviolet irradiation, in which ultraviolet rays are applied to the developed positive photoresist image, placed in a chamber filled with gas of lower pressure than 1 atmospheric pressure using a means to intercept or reduce selectively all or part of the wavelengths in the spectral response region of the positive photoresist out of radiant lights obtained from the discharge lamp.
REFERENCES:
patent: 4548688 (1985-10-01), Matthews
patent: 4749436 (1988-06-01), Minato et al.
Matthews et al., "Stabilization of Single Layer and Multilayer Resist Patterns" . . . , Fusion Semiconductor Systems, SPIE Conf., Optical Mircolithography, 111, Calif., Mar. 14-15, 1984.
UV Hardening of Photo and Electron Beam Resist Patterns, J. Vac. Scl. Technol., 19(4), Nov./Dec. 1981.
High Temperature Flow Resistance of Micron Sized Images in AZ Resists, H. Hiraoka and J. Pacansky, IBM Research Laboratory, San Jose, Calif.
Deep U.V. Hardening of Positive Photoresist Patterns Journal of the Electrochemical Society, Jun. 1982.
Stabilization of Single Layer and Multilayer Resist Patterns to Aluminum Etching Environments, Fusion Semiconductor Systems, Mar. 1984.
Deep U.V. Hardening of Photo- and Electron Resist Patterns 1984, Dry Process Symposium, Matsushita Electronics Corporation.
Double Exposure Stabilization of Positive Photoresist Journal of Applied Polymer Science, vol. 30, 547-555, (1985).
Arai Tetsuji
Mimura Yoshiki
Suzuki Hiroko
Suzuki Shinji
Ueki Kazuyoshi
Dees Jos,e G.
Ushio Denki
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