Method of treating copper foil for printed circuits

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Forming nonelectrolytic coating after depositing...

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205196, 205197, 205245, C23C 2800, C25D 356

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active

057003629

ABSTRACT:
A copper foil for printed circuits of which a shiny side has resin dust resistance, excels in heat discoloration resistance and rust preventiveness, and does not adversely affect the solderability and resist adhesion, and a method of treating the surface of such copper foil. The copper foil for a printed circuit comprises a first layer of zinc alloy composed of zinc and nickel and/or cobalt, formed on the shiny side surface of a copper foil, and a second layer composed of a mixture or compound of benzotriazole derivative and phosphorus compound (and silicon compound) formed on the layer. The method for treating the surface of a copper foil for a printed circuit comprises the steps of forming a first layer of zinc alloy composed of zinc and nickel and/or cobalt by electroplating on the shiny side surface of a copper foil, and forming a second layer by immersing it in an aqueous solution of benzotriazole derivative and phosphorus compound (and silicon compound).

REFERENCES:
patent: 4082591 (1978-04-01), Morisaki et al.
patent: 4529487 (1985-07-01), Hsu et al.

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