Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2006-12-12
2006-12-12
Fiorilla, Chris (Department: 1734)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S230000, C156S249000, C438S149000, C438S450000
Reexamination Certificate
active
07147740
ABSTRACT:
An object of the present invention is to provide a method of transferring an object to be peeled onto a transferring member in a short time without imparting damage to the object to be peeled within a laminate. Also, another object of the present invention is to provide a method of manufacturing a semiconductor device in which a semiconductor element manufactured on a substrate is transferred onto a transferring member, typically, a plastic substrate. The methods are characterized by including: forming a peeling layer and an object to be peeled on a substrate; bonding the object to be peeled and a support through a two-sided tape; peeling the object to be peeled from the peeling layer by using a physical method, and then bonding the object to be peeled onto a transferring member; and peeling the support and the two-sided tape from the object to be peeled.
REFERENCES:
patent: 5206749 (1993-04-01), Zavracky et al.
patent: 5391257 (1995-02-01), Sullivan et al.
patent: 5834327 (1998-11-01), Yamazaki et al.
patent: 6100166 (2000-08-01), Sakaguchi et al.
patent: 6127199 (2000-10-01), Inoue et al.
patent: 6372608 (2002-04-01), Shimoda et al.
patent: 6534382 (2003-03-01), Sakaguchi et al.
patent: RE38466 (2004-03-01), Inoue et al.
patent: 2002/0146893 (2002-10-01), Shimoda et al.
patent: 2003/0032210 (2003-02-01), Takayama et al.
patent: 2003/0082889 (2003-05-01), Maruyama et al.
patent: 2003/0203547 (2003-10-01), Sakaguchi et al.
patent: 2003/0224582 (2003-12-01), Shimoda et al.
patent: 2004/0219762 (2004-11-01), Shimoda et al.
patent: 0 849 788 (1998-06-01), None
patent: 0 858 110 (1998-08-01), None
patent: 05-243519 (1993-09-01), None
patent: 09-105896 (1997-04-01), None
patent: 10-125929 (1998-05-01), None
patent: 10-125931 (1998-05-01), None
patent: 11-243209 (1999-09-01), None
patent: 11243209 (1999-09-01), None
patent: 2001-125138 (2001-05-01), None
patent: 2002-217391 (2002-08-01), None
Machine translation of JP 2002-217391 A obtained from http://www.ipdl.ncipi.go.jp/homepg—e.ipdl.
Machine translation of JP 10-125929 A obtained from http://www.ipdl.ncipi.go.jp/homepg—e.ipdl.
European Search Report dated Dec. 14, 2004 for EP 03 01 0502.
Goto Yuugo
Maruyama Junya
Ohno Yumiko
Takayama Toru
Fiorilla Chris
Mazumdar Sonya
Robinson Eric J.
Robinson Intellectual Property Law Offices, P.C.
Semiconductor Energy Laboratory Co,. Ltd.
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