Method of transfer molding electronic packages and packages prod

Details Method of transfer molding electronic packages and packages prod Method of transfer molding electronic packages and packages prod

1996-03-18

1998-06-16

Picardat, Kevin

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438122, H01L 2160

Patent

active

057669864

ABSTRACT:
A printed wiring board with either a pin grid array, a ball grid array, a land grid array, etc. of electrical contacts is prepared with a heat sink in the usual manner. A passage is provided either in the printed wiring board or in the heat sink so that during the transfer molding process, fluid molding compound passes latitudinally under the heat sink into a cavity below the heat sink to encapsulate the package.

REFERENCES:
patent: 4043027 (1977-08-01), Birchler et al.
patent: 4396936 (1983-08-01), McIver et al.
patent: 4437141 (1984-03-01), Prokop
patent: 4460537 (1984-07-01), Heinle
patent: 4688152 (1987-08-01), Chia
patent: 4778641 (1988-10-01), Chia
patent: 4823234 (1989-04-01), Konishi et al.
patent: 4859722 (1989-08-01), Shiobara et al.
patent: 4861251 (1989-08-01), Moitzger
patent: 4868349 (1989-09-01), Chia
patent: 4893172 (1990-01-01), Matsumoto et al.
patent: 4935581 (1990-06-01), Komathu
patent: 4954877 (1990-09-01), Nakanishi et al.
patent: 4954878 (1990-09-01), Fox et al.
patent: 4961105 (1990-10-01), Yamamoto
patent: 4972253 (1990-11-01), Palino et al.
patent: 4975756 (1990-12-01), Ackermann et al.
patent: 5019673 (1991-05-01), Juskey et al.
patent: 5091341 (1992-02-01), Asada et al.
patent: 5093282 (1992-03-01), Ohno et al.
patent: 5102829 (1992-04-01), Cohn
patent: 5132778 (1992-07-01), Juskey et al.
patent: 5136366 (1992-08-01), Worp et al.
patent: 5153385 (1992-10-01), Juskey et al.
patent: 5191511 (1993-03-01), Sawaya
patent: 5210440 (1993-05-01), Long
patent: 5216278 (1993-06-01), Lin et al.
patent: 5218759 (1993-06-01), Juskey et al.
patent: 5241133 (1993-08-01), Mullen, III et al.
patent: 5244838 (1993-09-01), Casati et al.
patent: 5254500 (1993-10-01), Yeung
patent: 5291060 (1994-03-01), Shimizu et al.
patent: 5296738 (1994-03-01), Freyman et al.
patent: 5328870 (1994-07-01), Marrs
patent: 5355283 (1994-10-01), Marrs et al.
patent: 5438478 (1995-08-01), Kondo et al.
E. Stephans, "Pinless Module Connector," IBM Technical Disclosure Bulletin, No. 10:3872 (Mar. 1978).
Moore et al., "Solder Joint Reliability of Fine Pitch Solder Bumped Pad Array Carriers," pp. 264-274.

Affiliated with

Also associated with

Rating

Method of transfer molding electronic packages and packages prod does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of transfer molding electronic packages and packages prod, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of transfer molding electronic packages and packages prod will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1725311