Method of thin film forming on semiconductor substrate

Details Method of thin film forming on semiconductor substrate Method of thin film forming on semiconductor substrate

1996-09-06

1999-09-14

Bowers, Charles

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438672, H01L 2144

Patent

active

059536292

ABSTRACT:
Ultra fine powder of metal dispersed in organic solvent is applied onto a surface of a semiconductor substrate, and heated to evaporate solvent and to sinter the ultra fine powder of metal. Deep contact holes or via holes, and grooves or trenches in the substrate can be filled up with metal, and the surface of the substrate can be covered with thin metal film.

REFERENCES:
patent: 4569876 (1986-02-01), Nakikta
patent: 5294567 (1994-03-01), Dorfman

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