Method of thermal coupling an electronic device to a heat exchan

Details Method of thermal coupling an electronic device to a heat exchan Method of thermal coupling an electronic device to a heat exchan

1998-10-15

1999-07-06

Lazarus, Ira S.

Heat exchange

Intermediate fluent heat exchange material receiving and...

Liquid fluent heat exchange material

165 111, 165911, 165185, 7386311, 7386312, 257715, 364557, F28D 1500

Patent

active

059186658

ABSTRACT:
A temperature control system includes an electro-mechanical subassembly having an enhanced thermal interface, which comprises: an electronic device which has a face that dissipates heat; a heat exchange member which has a face that mates with the heat dissipating face of the electronic device; and, a film of liquid, lying between the mating faces of the heat exchange member and the electronic device, which evaporates without leaving any residue at a temperature that is too low to damage the electronic device. Due to the presence of the liquid film, the thermal resistance between the mating faces of the heat exchange member and the electronic device is reduced by over 1000% from which it otherwise is when film is deleted.

REFERENCES:
patent: 4734872 (1988-03-01), Eager et al.
patent: 5325913 (1994-07-01), Altoz
patent: 5783862 (1998-07-01), Deeney

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