Method of testing individual dies on semiconductor wafers prior

Details Method of testing individual dies on semiconductor wafers prior Method of testing individual dies on semiconductor wafers prior

1992-02-07

1994-01-18

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437227, 371 214, 371 216, H01L 2166, H01L 2160

Patent

active

052799751

ABSTRACT:
A method of processing and testing a semiconductor wafer containing an array of integrated circuit dies comprises: a) providing die test cycling circuitry on the wafer b) etching contact openings through a passivation layer atop the wafer to Vcc and Vss pads associated with individual dies; c) patterning a layer of conductive material atop the water to provide a Vcc bus and a Vss bus which interconnect with the Vcc and Vss pads respectively, the Vcc bus electrically connecting with the test cycling circuitry; d) burn-in testing the wafer with selected voltages being applied to the Vss and Vcc buses e) etching the Vcc bus and Vss bus from the wafer; f) etching contact openings through the passivation layer to conductive pads on individual dies; g) testing the individual dies for operability by engaging the conductive pads with testing equipment; h) identifying operable dies; i) singulating the dies; and j) collecting the operable dies.

REFERENCES:
patent: 3795972 (1974-03-01), Calhoun
patent: 3835530 (1974-09-01), Kilby
patent: 3839781 (1974-10-01), Russell
patent: 3849872 (1974-11-01), Hubacher
patent: 4104785 (1978-08-01), Shiba et al.
patent: 4288911 (1981-09-01), Ports
patent: 4778771 (1988-10-01), Hiki
patent: 4866714 (1989-09-01), Adams et al.
patent: 4967146 (1990-10-01), Morgan et al.
patent: 5047711 (1991-09-01), Smith et al.
patent: 5059899 (1991-10-01), Farnworth et al.

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