Active solid-state devices (e.g. – transistors – solid-state diode – Test or calibration structure
Reexamination Certificate
2006-04-20
2008-08-05
Coleman, W. David (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Test or calibration structure
C257SE21521
Reexamination Certificate
active
07408189
ABSTRACT:
A flexible printed circuit (FPC) having testing pads thereon is provided. The FPC comprises a plurality of bonding pads and a plurality of testing pads, wherein each of the testing pads is disposed corresponding to each of the bonding pads, and the testing pads are electrically isolated from the bonding pads. After the bonding pads of the FPC are bonded to pins of a display, the testing pads are electrically connected to the bonding pads on the FPC via the pins of the display. Therefore, the FPC bonding yield can be determined by measuring the electrical property of the testing pads.
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Coleman W. David
Liu & Liu
Nguyen Khiem D
TPO Displays Corp.
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