Method of testing conductor film quality

Details Method of testing conductor film quality Method of testing conductor film quality

1989-04-12

1991-02-05

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156630, 156633, 156643, 156651, 156653, 156657, 1566591, B44C 122, C03C 1500, C03C 2506

Patent

active

049902180

ABSTRACT:
A method of testing the quality of a conductor film laminated onto a surface of a substrate, is carried out by the steps of mounting a testing stand having a T-shaped cross section on the surface of the substrate, the testing stand being provided with an undercut portion around the entire side periphery thereof, laminating a conductor film having a predetermined thickness on the surface of the substrate, and forming on the top surface of the testing stand a wiring pattern formed with a conductor film insulated from the first mentioned conductor film laminated onto the substrate. An electric current is then applied to the wiring pattern. A characteristic test of the conductor film can therefore be performed immediately after the laminating of the conductor film to significantly reduce the testing time.

REFERENCES:
C. C. Hong, et al., "A New Technique for Monitoring Metallization Reliability at Wafer Level", IEEE/IRPS, 1985, pp. 108-114.

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