Method of temporarily securing a die to a burn-in carrier

Details Method of temporarily securing a die to a burn-in carrier Method of temporarily securing a die to a burn-in carrier

2006-09-12

2006-09-12

Graybill, David E. (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S119000

Reexamination Certificate

active

07105380

ABSTRACT:
A method of using adhesive tape to temporarily retain a die being temporarily held in a fixture during testing and burn-in. The method of the present invention uses a die cut piece of adhesively coated tape to hold a die in a test and burn-in fixture. Upon subsequent heating of the tape beyond the normal operating range of the adhesive coating on the tape, the die is removed from the tape, the tape is removed from the test and burn-in fixture, and the remaining adhesive, if any, is removed from the test and burn-in fixture.

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