Method of surface treatment of copper foil or a copper clad lami

Details Method of surface treatment of copper foil or a copper clad lami Method of surface treatment of copper foil or a copper clad lami

1989-03-23

1991-01-01

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

204 521, C25D 338, C25D 706

Patent

active

049815601

ABSTRACT:
The surface of copper foil or a copper clad laminate for an internal layer is subjected to electrolysis in an aqueous solution containing diethylenetriamine pentacetic acid and copper ion by using the copper foil or a copper clad laminate for the internal layer as the cathode.

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