Method of surface treatment of copper foil for printed circuit b

Details Method of surface treatment of copper foil for printed circuit b Method of surface treatment of copper foil for printed circuit b

1991-12-04

1993-08-10

Tufariello, T. M.

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating predominantly single metal or alloy substrate of...

C25D 706

Patent

active

052345734

ABSTRACT:
A method of surface treatment of a copper foil for printed circuit boards comprising the steps of forming a treating layer of copper-zinc or copper-zinc-nickel by electrolysing at least a side of a copper foil in a manner of cathodic electrolysis in a bath of copper-zinc including copper ion, zinc ion, tartaric acid and alkali or further including nickel ion, and giving a chromate treatment to the copper foil. A copper foil for printed circuit boards obtained by using a copper-zinc-nickel bath.

REFERENCES:
patent: 5019222 (1991-05-01), Hino

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