Method of surface-treating semiconductor substrate

Details Method of surface-treating semiconductor substrate Method of surface-treating semiconductor substrate

1980-05-16

1981-10-13

Massie, Jerome W.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

252 793, 252 795, C09K 1302, C09K 1308, H01L 21306

Patent

active

042946514

ABSTRACT:
A surface or surfaces of a semiconductor substrate are roughened by etching the substrate with an etchant containing (i) hydrofluoric acid, ammonium fluoride and/or acid ammonium fluoride, (ii) at least one manganese- or chromium-containing oxidizing agent, such as potassium permanganate, potassium manganate, chromium trioxide, potassium or sodium chromate and potassium or sodium dichromate, and (iii) an alkali. If a rougher surface or surfaces are desired, the substrate is pre-etched with an etchant containing (i) the fluorine-containing compound and (ii) the manganese-containing oxidizing agent, and then, etched with the above-mentioned etchant.

REFERENCES:
patent: 3309760 (1967-03-01), Reznick et al.
patent: 3791948 (1974-02-01), Dixon et al.
patent: 3833435 (1974-09-01), Logan et al.
patent: 3930065 (1975-12-01), Baker et al.
patent: 3936331 (1976-02-01), Luce et al.
patent: 3986251 (1976-10-01), Altemus et al.
patent: 4043861 (1977-08-01), Jacob et al.
patent: 4049488 (1977-09-01), Tijburg
patent: 4100014 (1978-07-01), Kuhn-Kuhnenfeld
patent: 4137123 (1979-01-01), Bailey et al.
patent: 4147564 (1979-04-01), Magee et al.
patent: 4171242 (1979-10-01), Liu
Jenkins, "A New Crystals" J. of Electrochemical Soc., vol. 124, No. 5 (5/77) pp. 757-762.

Affiliated with

Also associated with

Rating

Method of surface-treating semiconductor substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of surface-treating semiconductor substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of surface-treating semiconductor substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-929323