Method of supplying slurry and a slurry supply apparatus...

Abrading – Abrading process – Abradant supplying

Reexamination Certificate

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Details

C451S036000, C451S037000, C451S041000, C451S087000, C451S091000, C451S099000, C451S287000, C451S446000

Reexamination Certificate

active

06910954

ABSTRACT:
A computer-controlled slurry supplying apparatus for providing abrasive slurry to a chemical mechanical polishing (CMP) machine in a semiconductor manufacturing process preferably comprises a storage portion for accepting and storing a quantity of undiluted slurry, a mixing portion for accepting undiluted slurry from the storage portion and mixing with a diluting solution to created a diluted slurry, a supply portion for holding the diluted slurry, and at least one point-of-use mixing unit for mixing at least one chemical additive to the diluted slurry at or near a dispensing nozzle at the point of application. Each of the above portions of the slurry supplying apparatus further includes a re-circulation means for keep solutions in a mixed and agitated state. A method for using the slurry supplying apparatus comprises steps of controllably operating various valves, pumps, and sensors to maintain a desired slurry composition and flow rate.

REFERENCES:
patent: 5478435 (1995-12-01), Murphy et al.
patent: 5957759 (1999-09-01), Cardenas et al.
patent: 6059920 (2000-05-01), Nojo et al.
patent: 6338671 (2002-01-01), Kawashima et al.
patent: 6406364 (2002-06-01), Kimura et al.
patent: 6457852 (2002-10-01), Hiraoka et al.
patent: 2000-202774 (2000-07-01), None

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