Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2005-12-28
2008-10-07
Clark, S. V. (Department: 2823)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C257S768000
Reexamination Certificate
active
07432202
ABSTRACT:
A method includes forming a coating on a land contact of a package substrate, the coating including a first material disposed between a first layer and a second layer, each of the first layer and the second layer being made of a second material including gold. An apparatus includes a package substrate including a plurality of land contacts wherein each of the plurality of land contacts includes a coating including a first material disposed between a first layer and a second layer, each of the first layer and the second layer being made of a second material including gold.
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Bchir Omar J.
Gurumurthy Charavana K.
Nasir Ehab A.
Saha Bijay S.
Toyama Munehiro
Blakely , Sokoloff, Taylor & Zafman LLP
Clark S. V.
Intel Corporation
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