Method of structuring with metal oxide masks by reactive ion-bea

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156646, 156652, 1566591, 156667, 156904, 204192E, C23F 102, B44C 122, C03C 1500, C03C 2506

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043903940

ABSTRACT:
Very fine circuit structures in microelectronics are produced by first applying a thin metal oxide layer uniformly over an entire surface of a layer to be etched, then applying a resist layer uniformly over the entire metal oxide layer and structuring such oxide layer by ion-beam etching and, utilizing the structured oxide layer as a mask, performing a dry-etching with an ion beam of the metal layer lying thereunder so as to attain structures having very unfavorable resist height to etching depth ratios.

REFERENCES:
patent: 3904462 (1975-09-01), Dimigen et al.
patent: 3975252 (1976-08-01), Fraser
patent: 4132586 (1979-01-01), Schaible et al.
Michel Contagrel, "Considerations on High Resolution Patterns Engraved by Ion Etching", IEEE Transactions on Electron Devices, vol. ED-22, Jul. 1975, pp. 483-486.

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