Method of structuring thin layers

Details Method of structuring thin layers Method of structuring thin layers

1977-02-08

1978-10-10

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156668, 427264, B44C 122, B29C 1708

Patent

active

041194837

ABSTRACT:
A method of structuring oxide layers, nitride layers or magnetic layers in such manner that a photolacquer mask is manufactured on a substrate and the layer to be structured is provided by means of cathode sputtering both on the photolacquer mask and on the surfaces of the substrate not covered with lacquer. The substrate is then treated with a solvent attacking the lacquer mask; the mask swells up and the parts of the layer to be structured present thereon are chipped off. In order to stimulate this latter process, a layer is provided below the photolacquer mask on the substrate relative to which photolacquer has a small adhesive capacity and, after providing the layer to be structured, an increase in volume of the lacquer mask is produced by thermal treatment. After the complete removal of the photolacquer mask and the parts of the layer to be structured present thereon, the structured thin layer remains on the substrate as a negative of the pattern of the photolacquer mask.

REFERENCES:
patent: 3443915 (1969-05-01), Wood et al.
patent: 3567508 (1971-03-01), Cox et al.
patent: 3723277 (1973-03-01), Schmiedecke

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