Method of stimulating die circuitry and structure therefor

Details Method of stimulating die circuitry and structure therefor Method of stimulating die circuitry and structure therefor

2006-05-26

2010-06-22

Ghyka, Alexander G (Department: 2812)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

Having specified scribe region structure

C438S460000, C257SE21523, C257SE21524

Reexamination Certificate

active

07741195

ABSTRACT:
A method includes providing a wafer having a first die and a scribe grid, where the first die has die circuitry and a bond pad electrically connected to the die circuitry, and where the scribe grid has a scribe grid pad electrically connected to the die circuitry. The method further includes accessing the scribe grid pad to stimulate the die circuitry. A wafer includes a first die. The first die includes die circuitry, a plurality of conductive layers, and a bond pad electrically connected to the die circuitry via at least one conductive layer of the plurality of conductive layers. The wafer includes a scribe grid having a scribe grid pad, and an interconnect electrically connecting the scribe grid pad to the die circuitry. The plurality of die of the wafer can then be singulated, and at least one of the singulated die can be packaged.

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Robert J. Small, Shihying Lee, Eric Finson, and David Maloney, “Experimenting with new cleaning technologies for use in semiconductor manufacturing,” DuPont Electronic Technologies website, micro paper Apr. 2002.

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