Method of sputtering selected oxides and nitrides for forming ma

Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering

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20419212, 2041922, 20419216, 20429813, C23C 1434

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active

059763264

ABSTRACT:
A Co--Pt based magnetic alloy which has been sputtered with an oxide or nitride of a primary constituent of the magnetic layer, e.g., CoO below about 10 at. %, provides improved coercivity, squareness, and reduced noise as compared to magnetic alloys with oxygen introduced by other methods. The alloy is vacuum deposited, for example, by sputtering, and the oxide or nitride may be introduced from the sputtering target from which the magnetic layer materials come or from a separate sputtering target. Examples of such oxides and nitrides include CoO, Co.sub.2 0.sub.3, Co.sub.3 O.sub.4, CrO.sub.2, Cr.sub.2 O.sub.3, TiO.sub.2, Ta.sub.2 O.sub.5, Al.sub.2 O.sub.3, WO, CoN, Co.sub.2 N, TiN, TaN, CrN, NiN, etc.

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