Method of spraying release agent

Details Method of spraying release agent Method of spraying release agent

1991-08-15

1993-06-15

Bell, Janyce

Coating processes

Mold coating

427135, 427256, 427287, 427421, 26427217, 264338, B05D 102

Patent

active

052196089

ABSTRACT:
A method of spraying release agent on a semiconductor chip molding die. The die has a pot for supplying resin to be molded, cavities in which semiconductor chips to be packaged are disposed, respectively, and a runner disposed between the pot and the cavities, for conducting the resin from the pot to the cavities. This method includes the steps of spraying at least the pot and the runner mentioned above with non-silicone release agent and selectively spraying only the cavities with silicone-based release agent.

REFERENCES:
patent: 4442056 (1984-04-01), Slepcevic
patent: 4470940 (1984-09-01), Whitehurst
patent: 4741507 (1988-05-01), Baird
patent: 5064583 (1991-11-01), Dagostino et al.

Affiliated with

Also associated with

Rating

Method of spraying release agent does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of spraying release agent, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of spraying release agent will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1041059