Method of spin-on-glass planarization

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate

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438633, 438692, 438780, H01L 2131, H01L 21469

Patent

active

061177989

ABSTRACT:
A method of spin-on-glass planarization. A spin-on-glass layer is formed on a substrate. An accuflo layer with a better fluidity than the spin-on-glass material is formed on the spin-on-glass layer. The accuflo layer and the spin-on-glass layer are etched back by two etching steps with different etching rate. The accuflo layer after being etched is stripped. A dielectric layer is formed.

REFERENCES:
patent: 5607880 (1997-03-01), Suzuki et al.
patent: 5747381 (1998-05-01), Wu et al.
patent: 5783482 (1998-07-01), Lee et al.
patent: 5948700 (1999-09-01), Zheng et al.
patent: 6030706 (2000-02-01), Eissa et al.
patent: 6030892 (2000-02-01), Wu et al.

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