Method of smoothing out an irregular surface of an electronic de

Details Method of smoothing out an irregular surface of an electronic de Method of smoothing out an irregular surface of an electronic de

1986-03-24

1987-05-05

Lindsay, Robert

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156648, 156651, 156657, 156668, 1566611, B44C 122, H01L 21306

Patent

active

046629858

ABSTRACT:
An photoresist deposited by sputtering or evaporation on an insulation layer to be smoothed out is etched by an ion beam applied at a first angle of ion bombardment which is smaller than an angle of ion bombardment at which the photoresist can be etched at a maximum etching rate. Thereafter, the photoresist and the insulation layer are etched at a second angle of ion bombardment at which the photoresist and the insulation layer are etched at the same rate. The first angle is larger than 30.degree. and smaller than 45.degree., and the second angle is 75.degree..

REFERENCES:
patent: 4444616 (1984-04-01), Fujita
patent: 4460434 (1984-07-01), Johnson et al.
patent: 4514479 (1985-04-01), Ferrante

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