Method of smoothing fluorine-containing resin molded article and

Details Method of smoothing fluorine-containing resin molded article and Method of smoothing fluorine-containing resin molded article and

1997-07-18

2000-11-14

Guay, John

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

438126, 438127, 427302, 427340, 118667, 118692, H01L 2148

Patent

active

061469238

ABSTRACT:
A fluorine-containing resin molded article can be obtained by putting it between smooth molds having a surface roughness (Ra) of not more than 50 .ANG. and compression-molding it under molding conditions of a molding temperature of 270.degree. to 340.degree. C., a molding pressure of not less than 10 kg/cm.sup.2 and compression time of not less than 2 minutes, to give smoothed fluorine-containing resin molded article having a surface roughness of not more than 500 .ANG.. Particles, metal impurities, organic impurities or the like are difficult to adhere to the surface of the article, and can be removed significantly by washing.

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