4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Insulative housing or support

Katsuhide Ohtani

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Method of smoothing fluorine-containing resin molded article and

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Patent

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Molding material for ozone-resistant articles and...

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Polymers from only ethylenic monomers or processes of...
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1824875

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