Method of simultaneously etching personality and select

Details Method of simultaneously etching personality and select Method of simultaneously etching personality and select

1986-10-29

1987-08-04

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156646, 156656, 1566591, 156668, 156345, 219121LJ, 219121LM, 20419234, 427 431, 427 531, 430 5, 430313, 430318, B44C 122, C23F 102, C03C 1500, B29C 3700

Patent

active

046844368

ABSTRACT:
A method for performing differential etching of material by using electromagnetic radiation. Material having two predetermined regions is provided. A beam of electromagnetic radiation is generated. The energy intensity of predetermined areas within the beam of electromagnetic radiation is selectively varied so that both of the predetermined regions of the material are etched simultaneously and each of the predetermined regions is etched at a rate independent of the etching rate of the other of the predetermined regions. In an alternate embodiment, a substance having at least two materials is provided. A beam of electromagnetic radiation is generated. The energy intensity of predetermined areas within the beam of electromagnetic radiation is selectively varied so that the time required to etch one of the materials is substantially equal to the time required to etch any selected combination of the materials remaining.

REFERENCES:
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patent: 4035522 (1977-07-01), Hatzakis
patent: 4151072 (1979-05-01), Hutchings
patent: 4415262 (1983-11-01), Koyama et al.
patent: 4490210 (1984-12-01), Chen et al.
patent: 4490211 (1984-12-01), Chen et al.
patent: 4508749 (1985-02-01), Brannon et al.

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