Method of simultaneously etching multiple tapered viaducts in se

Details Method of simultaneously etching multiple tapered viaducts in se Method of simultaneously etching multiple tapered viaducts in se

1977-03-28

1978-01-03

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156643, 156646, 156657, 156659, 204192E, 239601, B23P 1500, B23P 2506

Patent

active

040664910

ABSTRACT:
Several tapered viaducts or through-holes of uniform size are simultaneously fabricated by etching in a dielectric plate or substrate. The viaducts, which are designed in particular for nozzles for ink jet printers, have identical orifice widths, irrespective of differences in the thickness of the substrate or dielectric plate or different etch rates in the various areas of the dielectric plate. The holes are first chemically pre-etched until the first hole is about to penetrate through the plate and subsequently sputter etching is applied until all holes have penetrated through the plate, whereby the dielectric plate provides the necessary sputter etch capacity on which a negative bias occurs.

REFERENCES:
patent: 3474021 (1969-10-01), Davidse et al.
patent: 3958255 (1976-05-01), Chiou et al.

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