Method of separating layers of material

Details Method of separating layers of material Method of separating layers of material

2007-06-13

2010-12-07

Culbert, Roberts (Department: 1716)

Semiconductor device manufacturing: process

Chemical etching

Vapor phase etching

C216S065000

Reexamination Certificate

active

07846847

ABSTRACT:
A lift off process is used to separate a layer of material from a substrate by irradiating an interface between the layer of material and the substrate. According to one exemplary process, the layer is separated into a plurality of sections corresponding to dies on the substrate and a homogeneous beam spot is shaped to cover an integer number of the sections.

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