Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Subsequent separation into plural bodies
Reexamination Certificate
2007-07-10
2007-07-10
Evans, Geoffrey S. (Department: 1725)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
Subsequent separation into plural bodies
C219S121800, C219S121850, C438S463000
Reexamination Certificate
active
11215248
ABSTRACT:
A lift off process is used to separate a layer of material from a substrate by irradiating an interface between the layer of material and the substrate. According to one exemplary process, the layer is separated into a plurality of sections corresponding to dies on the substrate and a homogeneous beam spot is shaped to cover an integer number of the sections.
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Wo
Park Jongkook
Sercel Jeffrey P.
Sercel Patrick J.
Evans Geoffrey S.
Grossman Tucker Perreault & Pfleger PLLC
J.P. Sercel Associates Inc.
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