Method of sensor packaging

Details Method of sensor packaging Method of sensor packaging

2007-11-27

2007-11-27

Zarneke, David A. (Department: 2891)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C257SE21499

Reexamination Certificate

active

11134709

ABSTRACT:
The present invention is directed to a method of making flexible interconnect packaging, in particular, packaging for fingerprint sensor chips. The chip is mounted on a flexible substrate having conductive traces leading to a connector at an end of the substrate. Wires are used to connect contact pads with the conductive traces, and a rigid frame is mounted below the substrate and chip. The conductive traces are preferably internal within the substrate and are exposed by forming a cavity in the substrate adjacent to the chip. Also disclosed are electronic devices which incorporate the foregoing fingerprint sensing apparatus.

REFERENCES:
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patent: 6014066 (2000-01-01), Harberts et al.
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patent: 6307258 (2001-10-01), Crane et al.
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patent: 2002/0081780 (2002-06-01), Salatino et al.
patent: 2003/0170933 (2003-09-01), Manansala
patent: WO 99/60513 (1999-11-01), None
patent: WO-01-75962 (2001-10-01), None

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