Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate
2011-01-18
2011-01-18
Mulpuri, Savitri (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including adhesive bonding step
C438S051000, C438S106000, C438S107000, C438S108000, C438S455000, C257SE21499, C257SE21501, C257SE21503, C257SE21512
Reexamination Certificate
active
07871860
ABSTRACT:
The present disclosure provides a method of fabricating a semiconductor device. The method includes providing a chip and a substrate. The method also includes bonding the chip to the substrate. The method also includes, after the bonding the chip, dispensing a sealing material between the chip and the substrate. In accordance with the method, the chip and the substrate are maintained within a temperature range from the bonding the chip to the dispensing the sealing material, and wherein a lower limit of the temperature range is approximately twice a room temperature.
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patent: 5869886 (1999-02-01), Tokuno
patent: 7190082 (2007-03-01), Nagarajan et al.
patent: 7193007 (2007-03-01), Cheng et al.
patent: 2002/0072151 (2002-06-01), Amami et al.
patent: 2007/0108634 (2007-05-01), Higashi et al.
Chen Chen-Shien
Lin Tsung-Shu
Pu Han-Ping
Ahmadi Mohsen
Haynes and Boone LLP
Mulpuri Savitri
Taiwan Semiconductor Manufacturing Company , Ltd.
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