Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of...
Reexamination Certificate
2011-03-01
2011-03-01
Dang, Phuc T (Department: 2892)
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
C438S669000, C438S672000, C257S642000, C257S914000
Reexamination Certificate
active
07897517
ABSTRACT:
A method for depositing one or more materials on a substrate, such as for example, a semiconductor substrate that includes providing the substrate; applying a polymer film to at least a portion of a surface of the substrate; and exposing the semiconductor substrate to a supercritical fluid containing at least one reactant for a time sufficient for the supercritical fluid to swell the polymer and for the at least one reactant to penetrate the polymer film. The reactant is reacted to cause the deposition of the material on at least a portion of the substrate. The substrate is removed from the supercritical fluid, and the polymer film is removed. The process permits the precise deposition of materials without the need for removal of excess material using chemical, physical, or a combination of chemical and physical removal techniques.
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Kramer Steve
Ohde Hiroyuki
Wai Chien M.
Dang Phuc T
Micro)n Technology, Inc.
Wells St. Johns P.S.
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