Method of sawing crystalline rods, and multiple-blade internal-h

Details Method of sawing crystalline rods, and multiple-blade internal-h Method of sawing crystalline rods, and multiple-blade internal-h

1983-04-21

1985-04-30

Whitehead, Harold D.

Abrasive tool making process, material, or composition

Impregnating or coating an abrasive tool

125 15, B24B 102

Patent

active

045135444

ABSTRACT:
Crystalline rods or blocks can be sawed into thin wafers by sawing the rod r block into a plurality of wafers that are connected to each other. The wafers can be connected by introducing a connecting agent after each sawing step, into the resulting cutting gaps. The wafers are separated only after the whole rod has been sawed. The method makes possible the use of multiple-blade internal-hole saws, and preferably two-blade internal-hole saws.

REFERENCES:
patent: 3081586 (1963-03-01), Gersbach
patent: 4091580 (1978-05-01), Oates
patent: 4150912 (1979-04-01), Gutsche
patent: 4227348 (1980-10-01), Demers
patent: 4228782 (1980-10-01), Demers

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