Method of rough polishing semiconductor wafers to reduce surface

Details Method of rough polishing semiconductor wafers to reduce surface Method of rough polishing semiconductor wafers to reduce surface

1994-05-18

1996-11-05

Kunemund, Robert

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

216 89, C03C 2506

Patent

active

055713734

ABSTRACT:
A method of rough polishing a semiconductor wafer to reduce roughness on a surface of the wafer prior to finish polishing the wafer by applying a polishing solution to a polishing material, contacting the polishing material and the polishing solution with the surface of the wafer as the wafer moves relative to the polishing material to reduce low frequency surface roughness of the wafer, applying a second polishing solution to the polishing material, and contacting the polishing material and the second polishing solution with the surface of the wafer as the wafer moves relative to the polishing material to further reduce the low frequency surface roughness, wherein the wafer has an average surface roughness not greater than 1.0 nm Ra, as measured on a 1 mm.times.1 mm scan with an optical interferometer, after being rough polished.

REFERENCES:
patent: 3170273 (1965-02-01), Walsh et al.
patent: 4968381 (1990-11-01), Prigge et al.
patent: 5032203 (1991-07-01), Doy et al.
patent: 5297361 (1994-03-01), Baldy et al.
patent: 5376222 (1994-12-01), Miyajima et al.
patent: 5383993 (1995-01-01), Katada et al.

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