Method of rinsing and drying semiconductor substrates

Details Method of rinsing and drying semiconductor substrates Method of rinsing and drying semiconductor substrates

2007-03-06

2007-03-06

El-Arini, Zeinab (Department: 1746)

Cleaning and liquid contact with solids

Processes

Using sequentially applied treating agents

C134S018000, C134S019000, C134S021000, C134S036000, C134S037000, C134S902000, C034S060000, C034S078000

Reexamination Certificate

active

10796507

ABSTRACT:
A method for cleaning and drying semiconductor wafers improves device yield by providing more advanced control of the ratio of drying fluid to cleaning fluid, for example the ratio of N2 vapor to IPA vapor. In addition, a quick drain process is employed to improve process throughput, and to further improve particle and watermark removal during the cleaning and drying steps.

REFERENCES:
patent: 5115576 (1992-05-01), Roberson et al.
patent: 5715612 (1998-02-01), Schwenkler
patent: 6284055 (2001-09-01), Dryer et al.
patent: 6328809 (2001-12-01), Elsawy et al.
patent: 2002/0174882 (2002-11-01), Kimura
patent: 2003-0063229 (2003-07-01), None

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