Method of reworking substrates, and solutions for use therein

Details Method of reworking substrates, and solutions for use therein Method of reworking substrates, and solutions for use therein

1980-03-17

1981-04-07

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156656, 252 791, C23F 100

Patent

active

042604516

ABSTRACT:
A solution for dissolving noble metal alloys which include tin, and other metals commonly used in semiconductor package substrates, having significant concentrations of KI, iodine and halogen ions selected from the group consisting of chloride and bromide ions.

REFERENCES:
patent: 3634159 (1972-01-01), Croskery
patent: 4190489 (1980-02-01), Bahl et al.
IBM Technical Disclosure Bulletin, vol. 10, No. 4, Sep. 1967, Etch for Removing Gold by R. Flitsch, p. 355.

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