Semiconductor device manufacturing: process – Repair or restoration
Patent
1997-05-21
1999-11-16
Dutton, Brian
Semiconductor device manufacturing: process
Repair or restoration
438 12, H01L 2100
Patent
active
059856777
ABSTRACT:
A semiconductor memory chip has fuses and a redundancy memory cell which can replace a normal memory cell that is found defective by cutting off the fuses. If the normal memory cell is defective, the fuses are cut off thereby to connect the redundancy memory cell instead of the normal memory cell which is defective. The entire surface of the semiconductor memory chip is coated with a resist layer. The coated the resist layer is exposed at regions of the fuses to an energy beam, and then developed form a resist pattern. The semiconductor memory chip is etched at the regions using the resist pattern as a mask for thereby cutting off the fuses. The fuses may be spaced at intervals of 2 .mu.m or smaller, and can be cut off without causing damage to a layer beneath the fuses.
REFERENCES:
patent: 4748597 (1988-05-01), Saito et al.
patent: 5698984 (1997-12-01), Bryant et al.
patent: 5837423 (1998-11-01), Okamoto
patent: 5840627 (1998-11-01), Huggins
Fukuhara Hideyuki
Kagawa Yoshinobu
Miyai Yoichi
Nishio Naoki
Advantest Corporation
Dutton Brian
Texas Instruments Japan
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