Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1984-04-30
1985-09-10
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
29852, 134 3, 134 28, 134 29, 156644, 156656, 156666, 156667, 156902, 174 685, 204 24, 204 321, 204192C, 204 384, 427 97, C23F 102, B44C 122, C23C 1500, B05D 512
Patent
active
045404640
ABSTRACT:
After cleaning and removal of oxidic layers, the defective copper conductors are completely etched off the surface of the external planes of a multilayer circuit board, and the copper on the walls of the plated through holes is etched at an etching rate continuously decreasing toward the center of the hole walls. Subsequently, an activating layer of copper is applied on the surface of the substrate and on the adjacent parts of the surface of the hole walls. Copper conductors defined by a photoresist mask in a known manner, are deposited on the surface of the activating layer following the additive technique, the copper is deposited on the entire surface of the hole walls. As the maximum etching depth of the copper on the hole wall is approximately 0.2 mm maximum, and as the activating layer is applied up to a depth of approximately 1.2 mm a perfect copper overlap on the walls is ensured.
REFERENCES:
patent: 3702284 (1972-11-01), Merkenschlayer
patent: 3717520 (1973-02-01), Brindisi
patent: 3923567 (1975-12-01), Lawrence
patent: 4418264 (1983-11-01), Thorwarth
Mueller Harald
Schwerdt Friedrich
Abzug Jesse L.
International Business Machines - Corporation
Kenemore Max J.
Powell William A.
Smith Marilyn D.
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