Method of removing surface defects or other recesses during the

Details Method of removing surface defects or other recesses during the Method of removing surface defects or other recesses during the

1997-12-08

2000-02-15

Breneman, Bruce

Semiconductor device manufacturing: process

Chemical etching

Combined with coating step

438720, 438723, 438742, H01L 21461

Patent

active

060252715

ABSTRACT:
A method for removing a surface defect from a dielectric layer during the formation of a semiconductor device comprises the steps of forming a dielectric layer having a hole therein, the dielectric also having a surface defect resulting from a previous manufacturing step such as chemical mechanical polish, contact with another surface during production, or from a manufacturing defect. A blanket conductive layer is then formed within the hole, within the surface defect, and over the dielectric layer. The conductive layer is etched from the surface of the dielectric using an etch which removes the conductive layer at a substantially faster rate than it removes the dielectric. This etch is stopped when the level of conductive material in the plug is flush with the upper surface of the dielectric. Next, the conductive and dielectric layers are etched using a dry or plasma etch which removes the conductive and dielectric layers at about the same rate. This etch continues until the surface defect in the dielectric layer is removed, thereby forming a nonrecessed plug.

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patent: 5585308 (1996-12-01), Sardella
patent: 5753547 (1998-05-01), Ying

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