Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1995-04-27
1998-08-11
Dang, Thi
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
1566461, H01L 21302
Patent
active
057923140
ABSTRACT:
A photosensitive resin removing method is capable of completely removing a photosensitive resin employed as a photoresist in an etching process for etching an aluminum film, and its derivatives and of improving the durability of a photosensitive resin removing apparatus for carrying out the method. A mixed gas is produced by mixing fluorine compound gas and steam, the mixed gas is excited with microwaves, and the photosensitive resin is exposed to the excited mixed gas to gasify the photosensitive resin.
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Nishioka Tadashi
Shima Hiroyuki
Dang Thi
Mitsubishi Denki & Kabushiki Kaisha
Ryoden Semiconductor System Engineering Corporation
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