Cleaning and liquid contact with solids – Processes – Including application of electrical radiant or wave energy...
Reexamination Certificate
2011-06-14
2011-06-14
Webb, Gregory E (Department: 1761)
Cleaning and liquid contact with solids
Processes
Including application of electrical radiant or wave energy...
C510S175000, C438S595000
Reexamination Certificate
active
07959738
ABSTRACT:
A method of removing a photoresist may include permeating supercritical carbon dioxide into the photoresist on a substrate having a conductive structure including a metal. The photoresist permeating the supercritical carbon dioxide may be easily removable. The photoresist permeating the supercritical carbon dioxide may be removed using a photoresist cleaning solution from the substrate. The photoresist cleaning solution may include an alkanolamine solution of about 8 percent by weight to about 20 percent by weight, a polar organic solution of about 25 percent by weight to about 40 percent by weight, a reducing agent of about 0.5 percent by weight to about 3 percent by weight with the remainder being water. The photoresist may be easily removed without damaging the conductive structure in a plasma process.
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Korean Office Action dated Sep. 20, 2007.
Han Dong-Gyun
Hong Chang-ki
Kang Dae-Hyuk
Lee Hyo-San
Lee Kun-Tack
Harness & Dickey & Pierce P.L.C.
Samsung Electronics Co,. Ltd.
Webb Gregory E
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