Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1994-12-09
1996-03-05
Powell, William
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
1566551, 1566561, 216 58, 216 77, 134 11, H01L 2100
Patent
active
054964385
ABSTRACT:
A method of removing photoresist (20) from a metal layer (16) formed on a substrate (1) and having a pattern defined by means of a corrosive gas plasma etch. The method consists of etching the resist (20) in an oxygen gas plasma for a period of time and at a sufficiently high temperature to remove all residual corrosive gas absorbed in the photoresist and below the temperature at which the metal beings to flow. An etching time of 3 minutes at 300.degree. C. is typically used.
REFERENCES:
patent: 4348473 (1982-09-01), Okumura et al.
patent: 5221424 (1993-06-01), Rhoades
patent: 5248384 (1993-09-01), Lin et al.
Dalziel John
Mautz Karl E.
Morland Graeme
Wootton Phil
Koch William E.
Motorola Inc.
Powell William
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