Method of removing copper ions from a bath containing same

Details Method of removing copper ions from a bath containing same Method of removing copper ions from a bath containing same

1979-01-22

1980-02-05

Prescott, Arthur C.

Chemistry: electrical and wave energy

Processes and products

204 44, 204148, C25C 112

Patent

active

041871669

ABSTRACT:
A process is provided for electrodepositing a covering layer of lead-tin on the surface of a bearing structure formed by co-electrodepositing lead, copper and tin which process comprises providing a metallic substrate; placing said metallic substrate in an electroplating bath containing lead ions, tin ions and copper ions; passing electrical current through said bath to deposit a layer of lead-tin-copper on the surface of said substrate; removing said so-plated substrate from said bath; subjecting said so-plated substrate to an aqueous rinsing media to remove electrolyte drag-out from said plating bath from the said plated substrate; bring said aqueous rinse media into contact with a metal selected from the group consisting of lead, tin and alloys thereof for a period of time sufficient to cause copper ions in said media to be replaced by ions of said metal and said copper ions to deposit as copper metal on the remainder of said metal; placing said rinsed substrate in an electroplating bath which is essentially devoid of copper ion and which contains both lead ions and tin ions; and passing electrical current through said electroplating bath to deposit a layer of lead-tin on the surface of said substrate.

REFERENCES:
patent: 3812020 (1974-05-01), Vander Mey
patent: 3940319 (1976-02-01), Pollack

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