Method of removing a glass backing plate from one major surface

Details Method of removing a glass backing plate from one major surface Method of removing a glass backing plate from one major surface

1984-01-26

1984-08-14

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29580, 134 38, 156633, 156655, 1566591, 156345, B44C 122, C03C 1500, C03C 2506

Patent

active

044655495

ABSTRACT:
A method is disclosed for removing a glass backing plate glued to one major surface of a semiconductor wafer having imaging elements formed on the opposed major surface of the wafer. The wafer is disposed in an etch impervious holder having a wafer support surface. The method includes the steps of providing a substantially etch impervious coating on the opposed major surface of the wafer including the imaging elements and a substantially etch impervious layer on the wafer support surface of the holder, then forming a substantially etch impervious, leak-tight seal between the wafer and the holder. The method further includes the steps of etching the glass plate in a suitable etching solution until the glass plate and the glue are dissolved from the one major surface of the wafer, and removing the substantially etch impervious coating on the opposed major surface of the wafer and the substantially etch impervious seal between the wafer and the holder. The one major surface of the wafer is cleaned to remove all traces of the glue therefrom.

REFERENCES:
patent: 3640792 (1972-02-01), Alleman et al.
patent: 3925657 (1975-12-01), Levine
patent: 4266334 (1981-05-01), Edwards et al.
patent: 4355229 (1982-10-01), Zimmerman et al.
U.S. Patent Application Ser. No. 494,288, Filed on May 13, 1983, by Zollman et al., entitled, "Intensified Charge Coupled Image Sensor Having an Improved CCD Support".

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