Method of reliably electroless-plating integrated circuit die

Details Method of reliably electroless-plating integrated circuit die Method of reliably electroless-plating integrated circuit die

2008-01-22

2008-01-22

Everhart, Caridad (Department: 2891)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S677000, C257SE21174, C257SE21224

Reexamination Certificate

active

07320937

ABSTRACT:
The present invention is a reliable method of electroless-plating integrated circuit die that achieves high yield. Die are attached to a holder using a polyimide adhesive to eliminate voltage differences on bond pads which would otherwise interfere with the plating. The die are aggressively cleaned using multiple cleaning solutions, one heated to a user-defined temperature. Each cleaning is followed by an aggressive rinse in de-ionized water. Die are immersed into multiple metal solutions at user-definable temperatures. Each immersion is followed by an aggressive rinse in de-ionized water, one with heated de-ionized water.

REFERENCES:
patent: 6028011 (2000-02-01), Takase et al.
patent: 6637638 (2003-10-01), Farnworth et al.
patent: 6759751 (2004-07-01), Sinha
patent: 6821909 (2004-11-01), Ramanathan et al.
patent: 2005/0001316 (2005-01-01), Dean et al.
patent: 2005/0001324 (2005-01-01), Dunn et al.
patent: 2005/0101130 (2005-05-01), Lopatin et al.
Jittinorasett, Suwanna; UBM Formation on Single Die/Dice for Flip Chip Applications; Thesis submitted to the Faculty of the Virginia Polytechnic Institute and State University for M.S.E.E; Aug. 29, 1999, Blacksburg, VA USA; Copyright 1999, Suwanna Jittinorasett.

Affiliated with

Also associated with

Rating

Method of reliably electroless-plating integrated circuit die does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of reliably electroless-plating integrated circuit die, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of reliably electroless-plating integrated circuit die will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2810157