Method of regulating substrate temperature in a low pressure env

Details Method of regulating substrate temperature in a low pressure env Method of regulating substrate temperature in a low pressure env

1997-11-14

1999-09-14

Ford, John K.

Heat exchange

With timer, programmer, time delay, or condition responsive...

Control of amount of conductive gas in confined space...

165 801, 165 802, 165 804, 156345, 118725, 20429809, F25B 2900

Patent

active

059507233

ABSTRACT:
A temperature controlled chuck (20) includes a heating unit (24) and a cooling unit (34). A first cavity (30) separates the heating unit (24) from a wafer substrate (18), and a second cavity (50) separates the cooling unit (34) from the heating unit (24). A first fluid delivery system (60) conducts fluid to the first cavity (30) to facilitate exchanges of heat between the heating unit (24) and the substrate (18). A second fluid delivery system (70) conducts fluid to the second cavity (50) to facilitate exchanges of heat between the heating unit (24) and the cooling unit (34). A control system (90) raises the temperature of the substrate (18) by increasing power to the heating unit (24) and by evacuating fluid from the second cavity (50) and lowers the temperature of the substrate (18) by reducing power to the heating unit (24) and by conducting fluid to the second cavity (50).

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