Method of regulating substrate temperature in a low pressure env

Heat exchange – With timer – programmer – time delay – or condition responsive... – Control of amount of conductive gas in confined space...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

165 801, 165 802, 165 804, 156345, 118725, 20429809, F25B 2900

Patent

active

059507233

ABSTRACT:
A temperature controlled chuck (20) includes a heating unit (24) and a cooling unit (34). A first cavity (30) separates the heating unit (24) from a wafer substrate (18), and a second cavity (50) separates the cooling unit (34) from the heating unit (24). A first fluid delivery system (60) conducts fluid to the first cavity (30) to facilitate exchanges of heat between the heating unit (24) and the substrate (18). A second fluid delivery system (70) conducts fluid to the second cavity (50) to facilitate exchanges of heat between the heating unit (24) and the cooling unit (34). A control system (90) raises the temperature of the substrate (18) by increasing power to the heating unit (24) and by evacuating fluid from the second cavity (50) and lowers the temperature of the substrate (18) by reducing power to the heating unit (24) and by conducting fluid to the second cavity (50).

REFERENCES:
patent: 3623712 (1971-11-01), McNeilly et al.
patent: 3836751 (1974-09-01), Anderson
patent: 4350537 (1982-09-01), Young et al.
patent: 4486652 (1984-12-01), Muka et al.
patent: 4492852 (1985-01-01), Finegan et al.
patent: 4493977 (1985-01-01), Arai et al.
patent: 4550245 (1985-10-01), Arai et al.
patent: 4560420 (1985-12-01), Lord
patent: 4680061 (1987-07-01), Lamont, Jr.
patent: 4743570 (1988-05-01), Lamont, Jr.
patent: 4857704 (1989-08-01), Jannot et al.
patent: 4909314 (1990-03-01), Lamont, Jr.
patent: 4949783 (1990-08-01), Lakios et al.
patent: 4971653 (1990-11-01), Powell et al.
patent: 5044943 (1991-09-01), Bowman et al.
patent: 5177878 (1993-01-01), Visser
patent: 5248402 (1993-09-01), Ballentine et al.
patent: 5294778 (1994-03-01), Carman et al.
patent: 5320982 (1994-06-01), Tsubone et al.
patent: 5382311 (1995-01-01), Ishikawa et al.
patent: 5567267 (1996-10-01), Kazama et al.
patent: 5676205 (1997-10-01), White

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of regulating substrate temperature in a low pressure env does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of regulating substrate temperature in a low pressure env, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of regulating substrate temperature in a low pressure env will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1499584

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.