Method of reflowing solder bumps after probe test

Details Method of reflowing solder bumps after probe test Method of reflowing solder bumps after probe test

1993-12-03

1999-03-23

Chaudhuri, Olik

Active solid-state devices (e.g., transistors, solid-state diode

Test or calibration structure

438 14, 438613, H01L 2358

Patent

active

058863621

ABSTRACT:
An integrated circuit die is tested by inserting test probe needles into flat solder pads before reflow. The testing is performed at different temperatures to functionally test the integrated circuit die. The solder pads are flat during probe test to improve the uniform contact point and pressure for the test probes, and help avoid slippage or sliding. The probe needles may cause indentation in the solder pads. Following probe test, the solder pads are reflowed to transform the solder pads into solder bumps. Reflow after probe test removes any indentations from the solder pads created during the probe test and leaves only rounded solder bumps without probe damage. The solder bumps are used to flip-chip interconnect the IC into end user systems.

REFERENCES:
patent: 4273859 (1981-06-01), Mones et al.
patent: 4814283 (1989-03-01), Temple et al.
patent: 5002895 (1991-03-01), LaParquier et al.
patent: 5289631 (1994-03-01), Koopman et al.

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