Method of reducing the thickness of a wafer of fragile material

Details Method of reducing the thickness of a wafer of fragile material Method of reducing the thickness of a wafer of fragile material

1975-08-22

1977-04-19

Van Horn, Charles E.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156345, 156654, 350 97, 356161, C23F 102

Patent

active

040186385

ABSTRACT:
A method of reducing the thickness of a wafer of fragile material, e.g. pyroelectric material, by placing the wafer, supported only at its rim, in a holder filled with a non-corrosive liquid. The holder with the exposed surface of wafer is placed in an etch bath to reduce the thickness of the wafer. The wafer is removed from the etch bath, without removing it from the holder, to measure its thickness, using its index of refraction, which is facilitated by the presence of a bubble in the non-corrosive liquid.

REFERENCES:
patent: 2549566 (1951-04-01), Bentley et al.
patent: 2998745 (1961-09-01), McClellan
patent: 3693025 (1972-09-01), Brunton
patent: 3807870 (1974-04-01), Kalman
patent: 3824017 (1974-06-01), Galyon
patent: 3930914 (1976-01-01), Hetrich
Chawalow, L. L. E., "Etch Completion Indication," IBM Technical Disclosure Bulletin, vol. 15, No. 2, 7/72, p. 606.

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