Semiconductor device manufacturing: process – Introduction of conductivity modifying dopant into... – Diffusing a dopant
Reexamination Certificate
2005-05-24
2005-05-24
Pham, Long (Department: 2814)
Semiconductor device manufacturing: process
Introduction of conductivity modifying dopant into...
Diffusing a dopant
C436S167000, C436S174000, C436S510000
Reexamination Certificate
active
06897132
ABSTRACT:
Disclosed is a method of reducing the conductivity/charge of a layer of group III-V semiconductor doped with Sn. The method includes the steps of: forming an region of SiO2on the semiconductor layer; annealing at least the semiconductor layer and the region of SiO2at a temperature sufficiently high to cause atoms of the Sn dopant to leach from the semiconductor layer into the region of SiO2; and removing the region of SiO2after the annealing step is performed. The method can be used, for example, during the manufacture of HEMT, PHEMT, MESFET and HBT devices.
REFERENCES:
patent: 4452646 (1984-06-01), Zuleeg
patent: 4544799 (1985-10-01), Barnett
patent: 4714948 (1987-12-01), Mimura et al.
patent: 5322808 (1994-06-01), Brown et al.
patent: 5536967 (1996-07-01), Yokoyama
patent: 6242293 (2001-06-01), Danzilio
patent: 6248666 (2001-06-01), Frijlink et al.
patent: 2202086 (1988-02-01), None
patent: 357015418 (1982-01-01), None
patent: 359072765 (1984-04-01), None
Docter Daniel P.
Kiziloglu Kursad
HRL Laboratories LLC
Ladas & Parry LLP
Le Thao X.
Pham Long
LandOfFree
Method of reducing the conductivity of a semiconductor and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of reducing the conductivity of a semiconductor and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of reducing the conductivity of a semiconductor and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3456127